| Advanced Burn-In & Test System~ ABTS-LTM
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System Benefits:
- Low Cost of Ownership
- Up to 72 burn-in board slots
- Small footprint
- No side access required
- Highly efficient power delivery
- Low-power standby mode
- High Reliability and Uptime
- Redundant architecture
- Hot-swap electronics and power supplies
- Addresses Diverse Needs
- Burn-in and test of high-power logic up to 75 W
- Individual device temperature sensing and control
- Production burn-in and test of low-power logic
- Highly Configurable for Production and Engineering
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| Advanced Burn-In & Test System~ ABTS-MTM |
System Benefits:
- Low Cost of Ownership
- 72 burn-in board slots (450mm x 570mm BIBs)
- Up to 18,432 memory devices
- Small footprint
- No side access required
- Highly efficient power delivery
- Low-power standby mode
- High Reliability and Uptime
- Redundant architecture
- Hot-swap electronics and power supplies
- Addresses Diverse Needs
- Burn-in and test of all DRAM, Flash & Logic
- Highly Configurable for Production and Engineering
- Cassette Handling of BIBs
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| Full-Wafer Burn-In & Test System ~ FOX 1TM |
System Benefits:
- Flexible Solution for High Throughput Test Floor
- Same system tests memory or logic
- Reduces floor space requirements
- Cost-effective Solution for Single Touchdown Full Wafer Test
- Dramatically reduces test time
- Up to 12,000 power channels
- Up to 3500 I/O channels (nearly 200,000 device I/O lines using parallel test technology)
- Electronics optimized for BIST/DFT testing
- Production Proven Full-Wafer Tester Solution
- Dozens of systems in production
- Protects wafers and probe cards with individual power channel over-current protection
- Standard cassette/FOUP automation
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| Full-Wafer Burn-In & Test System ~ FOX 15TM |
System Benefits:
- Cost-effective Solution for Producing:
- Known-Good-Die (KGD) for Multi-Chip Packages
- Zero-defect automotive ICs
- Production Proven Full-Wafer Burn-In Solution:
- Protects wafers and probe cards with individual power channel overcurrent protection
- High volume production capacity —15 wafer per load
- Reduces Costs:
- Reduces burn-in times by enabling higher burn-in temperatures
- Reduces final test costs by functionally testing wafer during burn-in
- Saves packaging costs by deferring until after burn-in
- Highly reliable — 4th generation design
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