Equipment by types >> Semiconductor Process

SRD 3000
  • The SRD System is designed to remove & de-solder the BGA burn-in socket from BIB.
  • Easy to operate.
  • Remove & de-solder defective burn-in socket in one goal.
  • Heating timer can be set to prevent the PCB from over heated/stress.
  • Consist of 3 preheat stages.
  • 2 different mode of accessibility (operator & engineering)
  • Intelligence LOG.
  • Changeable Nozzle kits to fit different size socket.
  • Board ID can be set as HEX for JEC and ANDO; DEC for MAX and MTX.
  • Flexibility of Burn-in Board layout design
Thumbnail image  
 
Manual Taping System ~ MT-50
  • Simple keypad and easy to read alphanumeric display for input of production counters
  • Tool-less changeover
  • Single, adjustable seal head accommodates any tape size and pocket geometry and can bond both heat sealable and pressure sensitive (PSA) tapes
  • Stepper motor drive insures an accurate part count
  • Multi-mode sealing provides Continuous, Reciprocating and Intermittent selection
  • Full and empty pocket verification
  • Optional in-tape 2D inspection featuring AVS™ software and dual-axis LED lighting
Thumbnail image  
 
Peel Strength Analyzer System ~ TP-150
  • Analyze strength of peel required for carrier tape
  • User friendly platform
  • Shows individual Pass/Fail criteria for each measurement and statistical calculation
Thumbnail image  
 

Go to top

Reflex - On-Demand Tape
  • Creating carrier tapes as and when it is required
  • Allows flexibility on tooling to create basic or complex carrier tapes
  • Space saving and power saving
  • Reduce operation intervention
 

Go to top

Advanced Burn-In & Test System~ ABTS-LTM
    System Benefits:
  • Low Cost of Ownership
  • Up to 72 burn-in board slots
  • Small footprint
  • No side access required
  • Highly efficient power delivery
  • Low-power standby mode
  • High Reliability and Uptime
  • Redundant architecture
  • Hot-swap electronics and power supplies
  • Addresses Diverse Needs
  • Burn-in and test of high-power logic up to 75 W
  • Individual device temperature sensing and control
  • Production burn-in and test of low-power logic
  • Highly Configurable for Production and Engineering
  

Go to top
Advanced Burn-In & Test System~ ABTS-MTM
    System Benefits:
  • Low Cost of Ownership
  • 72 burn-in board slots (450mm x 570mm BIBs)
  • Up to 18,432 memory devices
  • Small footprint
  • No side access required
  • Highly efficient power delivery
  • Low-power standby mode
  • High Reliability and Uptime
  • Redundant architecture
  • Hot-swap electronics and power supplies
  • Addresses Diverse Needs
  • Burn-in and test of all DRAM, Flash & Logic
  • Highly Configurable for Production and Engineering
  • Cassette Handling of BIBs
   
Full-Wafer Burn-In & Test System ~ FOX 1TM
    System Benefits:
  • Flexible Solution for High Throughput Test Floor
  • Same system tests memory or logic
  • Reduces floor space requirements
  • Cost-effective Solution for Single Touchdown Full Wafer Test
  • Dramatically reduces test time
  • Up to 12,000 power channels
  • Up to 3500 I/O channels (nearly 200,000 device I/O lines using parallel test technology)
  • Electronics optimized for BIST/DFT testing
  • Production Proven Full-Wafer Tester Solution
  • Dozens of systems in production
  • Protects wafers and probe cards with individual power channel over-current protection
  • Standard cassette/FOUP automation
  
Full-Wafer Burn-In & Test System ~ FOX 15TM
    System Benefits:
  • Cost-effective Solution for Producing:
  • Known-Good-Die (KGD) for Multi-Chip Packages
  • Zero-defect automotive ICs
  • Production Proven Full-Wafer Burn-In Solution:
  • Protects wafers and probe cards with individual power channel overcurrent protection
  • High volume production capacity —15 wafer per load
  • Reduces Costs:
  • Reduces burn-in times by enabling higher burn-in temperatures
  • Reduces final test costs by functionally testing wafer during burn-in
  • Saves packaging costs by deferring until after burn-in
  • Highly reliable — 4th generation design
  

Go to top

Burn-In Board Clean System ~ Model CBIB 1000
  • Clear particle and dust on the sockets contact
  • Eliminate contact problem on the sockets
  • After each cleaning, BIB cleaner will reset the clean counter in BIB management server
  • Upon each loading, ALU will increase the counter by 1
  • ALU will rejected the BIB if the count reached a pre-determined setting
Thumbnail image  
 
PICK & PLACE LOADER/UNLOADER ~ Model PPLU900
  • Wide range of application and high reliability
  • High speed production
  • Wide range of application
  • Tray module is desigend by verticaland horizon
  • The function Of linkingLINKING
Thumbnail image  
 
Auto Tray to Tray to Tube Exchanger ~ Model ATTUE7100
  • Designed for an automatically equipment to replace a labor power to do Tray-Tray & Tray-Tube two-way exchange
  • Device minimum is 3X3 mm
  • CCD Inspection and Sorting function
Thumbnail image  
 

Go to top


 
Tape and Reel System ~ DT-8800
  • Suitable for SOIC,SSOP,MSOP,TSSOP
  • High UPH – Tube to Tube /Tape (typical 12,000/9,500 UPH)
  • Semi-dedicated to body width for optimal setup,
  • Drop-Point taping,
  • Low guard-band inspection.
  • Low cost of ownership.
  
Tray Scanning and Taping System ~ ST-868
  • Suitable for BGA,LCC,QFP,CSP,TSOP
  • High Speed Tray to Tray /Tape transfer, (typical 15,000 UPH)
  • Complete High Res Inspection platform,
  • Completely Automatic output,
  • Simple changeover,
  • Forth Generation AVS™ DefectZero Inspection
   

Go to top