ESA - Innovative Works With Excellent Quality

T² VISION
Suitable for BGA, LCC, QFP, CSP, TSOP High Speed Tray to Tray/Tape Inspection System (typical 15,000 UPH) Complete High Resolution with 6-sides Inspection platform Completely Automatic output Simple changeover Fourth Generation AVS™ DefectZero Inspection

SRD 3000

The SRD System is designed to remove & de-solder the BGA burn-in socket from BIB
Easy to operate
Remove & de-solder defective burn-in socket in one goal.
Heating timer can be set to prevent the PCB from over heated/stress
Consist of 3 preheat stages
2 different mode of accessibility (operator & engineering)
Intelligence LOG
Changeable Nozzle kits to fit different size socket
Board ID can be set as HEX for JEC and ANDO; DEC for MAX and MTX
Flexibility of Burn-in Board layout design

Peel Strength Analyzer System ~ TP-150i

Analyze strength of peel required for carrier tape
User friendly platform
Shows individual Pass/Fail criteria for each measurement and statistical calculation

Manual Taping System ~ MT-50i

Simple keypad and easy to read alphanumeric display for input of production counters
Tool-less changeover
Single, adjustable seal head accommodates any tape size and pocket geometry and can bond both heat sealable and pressure sensitive (PSA) tapes
Stepper motor drive insures an accurate part count
Multi-mode sealing provides Continuous, Reciprocating and Intermittent selection
Full and empty pocket verification
Optional in-tape 2D inspection featuring AVS™ software and dual-axis LED lighting