Solar Cell Alkaline Saw Damage Etching and Texturing Equipment

Batch Type, fully automated system with high throughput and low wafer breakage rate Texture process for single-crystalline wafers. Special wafer drying system. Touch panel and easy-to-use UI operation system. Customer side MES/CIM data connection optional. Wafer size : 5”, 6”. Wafer Thickness : 160μm or thicker. Throughput: > 1200 PCS/HR ( 30MW ) Break rate:< 0.05% Equipment Dimension : Approx. 12 x 2 x 2.5 (m). Process Optimization Support. Off-line Process Monitor Support.

Solar Cell Acidic Saw Damage Etching and Texturing Equipment

Conveyor-Type with reliable mechanism to provide high throughput and low wafer breakage Texture process for Multi-crystaline wafers. Modular design on reaction and cleaning area. Touch panel and easy-to-use UI operation system. Customer side MES/CIM data connection optional. Wafer size : 6”. Wafer thickness : 160μm or thicker. Throughput: ＞ 1200 pcs/hr (30MW) Break rate＜ 0.2 % Equipment dimension: Approx. 11 x 2.3 x 2.2 (m). Process Optimization Support. In-line Process Monitor Optional.

Solar Wafer IQC Sorter
Throughput> 2000 pcs/hr Breakage Rate ＜ 0.3 % Inspection Items Lifetime  Sheet Resistance Thickness/TTV P/N type Micro crack AOI ( Optional ) Wafer Size 5" , 6"

Solar Cell PSG Removal Equipment
Throughput > 2000 pcs/hr (50MW) > 1200 pcs/hr (30MW) Breakage Rate ＜ 0.05 % Wafer Size 5" , 6" Wafer thickness : >160μm Dimension Approx.: 7.6 x 2 x 2.5 ( m )

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