• Chromatic Confocal
• Non-Contact
• No Moving Parts
• Uses Proprietary Technology
• Production Ready & Easy to Use
• Variable Range/Resolution
• 5X to 100X Objectives
• Can Use CCD for Standard Machine Vision Tasks (X-Y & Z!)
• Tolerant of Tilt
• Vibration Tolerant
• High Sensitivity—Measures Glass as Easily as Mirrors

• Chromatic Confocal
• Non-Contact
• No Moving Parts
• Uses Proprietary Technology
• Production Ready & Easy to Use
• Variable Range/Resolution
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Thickness Measurements Calibrated to NIST-Traceable Gage Block

Any Wafer Thickness Can Be Measured Capacitance Sensors Have Limitations

Small Spot Size / High Spatial Resolution ~5 or 10µm

Patterned Wafers

• - Microscope/Vision Can Guide
• - Measurements Locations

Measurement includes:

• - Shape of Top Surface & Bottom Surface
• - Independent Measurements
• - Determine True Center-of-Wafer Surface
• - Bow and Warp Defined by Center-of-Wafer
• - Compare to Interferometers
• - Roughness

Transparent Tape, Glass Carriers, Photoresist, etc.

• Allows ESD(HBM and MM) and Latch-up Tests
• Meets JEDEC, MIL, ESD Association and EIAJ standards, as well as future standards
• Drastic Test Time Reduction
• True constant current pulse and fast pulsed power supply
• Stabilizes DUT by pull-up/down and pattern generator
• Collects detail test results quickly by auto or manual operation
• Allows temperature coefficient test
• Minimum path resistance of power supplies
• Damage detection between tests
• Discharge between zap(s)
• Tests multiple DUT, multiple supply DUT and LCD drivers
• Function test available
• Low insertion force connectors on DUT board
• Complete diagnostics and easy maintenance
• Connectable with Ethernet
• Allows data manipulation by the data base program

• Field induced CDM via relay
• Stable and repeatable
• Current measurement at DUT pin side
• Coulomb measurement up to 100nC
• Simple pin positioning
• Automated test up to 10 DUT’s
• Measure damage voltage or energy
• Waveform Test results available to the production
• Fully automated CDM test
• Automatic test of VQFP and UQFP
• Test results handled by data base
• Test results transferred via LAN

• Field Induced CDM
• Direct Charging CDM
• HBM, Human Body Model
• MM, Machine Model
• TLP, Pulse Curve Measurement
• Mobile Charge Measurement

Meets MIL, JEDEC or JEITA standards

ESD simulation at a low cost.

• ESD Performance Test from Wafer to package
• Meets MIL, JEDEC or JEITA standards
• Able to perform HBM, MM, FI-CDM and D-CDM tests
• Process Monitoring by periodical wafer test
• Allows correlation test between die location and ESD performance
• Multiple return allows ESD current path verification
• Enables rapid ESD performance test of new devices
• Decreases device development time

• ESD Detection：Higher sensitivity, Broader BW
• Detect Field Induction (DCI) Threat
• PC logs data from multiple Units
• Digitized measurement
• Temperature and humidity monitor
• Both ESD and DCI detected simultaneously
• Electromagnetic wave generated by the ESD is received by the monopole antenna, amplified then peak value is measured.
• ESD polarity is decided whichever greater, positive or negative peak.
• Detection level: 1mV – 35mV at antenna
• Detected band width：About up to 2GHz
• Distance from ESD source: About 5 meters