• Batch Type, fully automated system with high throughput and low wafer breakage rate
• Texture process for single-crystalline wafers.
• Special wafer drying system.
• Touch panel and easy-to-use UI operation system.
• Customer side MES/CIM data connection optional.
• Wafer size : 5”, 6”.
• Wafer Thickness : 160μm or thicker.
• Throughput: > 1200 PCS/HR ( 30MW )
• Break rate:< 0.05%
• Equipment Dimension : Approx. 12 x 2 x 2.5 (m).
• Process Optimization Support.
• Off-line Process Monitor Support.

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