Product Description
Contact Us
Sales Contact Justin Ow
Office (65) 6296 1613 Ext 220
Skype ID Justin.ow80
Email Justin.ow@esasing.com
Solar Cell Alkaline Saw Damage Etching and Texturing Equipment

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  • Conveyor-Type with reliable mechanism to provide high throughput and low wafer breakage
  • Texture process for Multi-crystaline wafers.
  • Modular design on reaction and cleaning area.
  • Touch panel and easy-to-use UI operation system.
  • Customer side MES/CIM data connection optional.
  • Wafer size : 6”.
  • Wafer thickness : 160μm or thicker.
  • Throughput: > 1200 pcs/hr (30MW)
  • Break rate< 0.2 %
  • Equipment dimension: Approx. 11 x 2.3 x 2.2 (m).
  • Process Optimization Support.
  • In-line Process Monitor Optional.